
1+:¥1.5874
500+:¥1.4431
1000+:¥1.3744
3000+:¥1.3089

Logic level compatible
Trench MOSFET technology
MLPAK33 package (3.3 x 3.3 mm footprint)
1+:¥1.3599
500+:¥1.2363
1000+:¥1.1774
3000+:¥1.1213

Standard level compatibility
Trench MOSFET technology
Thermally efficient package in a small form factor (3.3 mm x 3.3 mm footprint)
1+:¥0.6633
500+:¥0.6030
1000+:¥0.5743
3000+:¥0.5469

High efficiency due to low switching and conduction losses
Robust construction for demanding applications
Standard level gate
1+:¥10.4948
500+:¥9.5407
1000+:¥9.0864
3000+:¥8.6537
限量供应

Logic-level compatible
Trench MOSFET technology
MLPAK33 package (3.3 x 3.3 mm footprint)
1+:¥1.8396
500+:¥1.6724
1000+:¥1.5928
3000+:¥1.5169
限量供应

100% avalanche tested at I(AS) = 190 A
Optimized for low RDSon
Low leakage < 1 μA at 25 °C
Low spiking and ringing for low EMI designs
Optimized for 4.5 V gate drive
Copper-clip for low parasitic inductance and resistance
High reliability LFPAK package, qualified to 175 °C
Wave solderable; exposed leads for optimal solder coverage and visual solder inspection
1+:¥6.4012
500+:¥5.8193
1000+:¥5.5421
3000+:¥5.2782
限量供应

Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥3.9905
500+:¥3.6278
1000+:¥3.4550
3000+:¥3.2905

280 A capability
Avalanche rated, 100% tested at IAS = 190 A
NextPower-S3 technology delivers 'superfast switching with soft recovery'
Low QRR, QG and QGD for high system efficiency and low EMI designs
Schottky-Plus body-diode, gives soft switching without the associated high IDSS leakage
Optimised for 4.5 V gate drive utilising NextPower-S3 Superjunction technology
High reliability LFPAK (Power SO8) package, copper-clip, solder die attach and qualifiedto150°C
Exposed leads can be wave soldered, visual solder joint inspection and high quality solder joints
Low parasitic inductance and resistance
1+:¥5.7572
500+:¥5.2338
1000+:¥4.9846
3000+:¥4.7472
限量供应

High efficiency due to low switching and conduction losses
Suitable for standard level gate drive
1+:¥6.2348
500+:¥5.6680
1000+:¥5.3981
3000+:¥5.1411
限量供应

Higher operating power due to low thermal resistance
Low conduction losses due to low on-state resistance
Suitable for high frequency applications due to fast switching characteristics
1+:¥10.0021
500+:¥9.0928
1000+:¥8.6598
3000+:¥8.2475
限量供应

Higher operating power due to low thermal resistance
Low conduction losses due to low on-state resistance
Simple gate drive required due to low gate charge
Suitable for high frequency applications due to fast switching characteristics
1+:¥6.8369
500+:¥6.2154
1000+:¥5.9194
3000+:¥5.6376
限量供应

Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
Superfast switching with soft-recovery; s-factor > 1
Low spiking and ringing for low EMI designs
Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at 25 °C
Optimised for 4.5 V gate drive
Low parasitic inductance and resistance
High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 175 °C
Wave solderable; exposed leads for optimal visual solder inspection
1+:¥2.5652
500+:¥2.3320
1000+:¥2.2209
3000+:¥2.1152
限量供应

High reliability Power SO8 package, qualified to 175°C
Optimised for 4.5V Gate drive utilising NextPower Superjunction technology
Ultra low QG, QGD, & QOSS for high system efficiencies at low and high loads
Ultra low Rdson and low parasitic inductance
1+:¥5.3279
500+:¥4.8435
1000+:¥4.6129
3000+:¥4.3932
限量供应

Enhanced forward biased safe operating area for superior linear mode operation
Low Rdson for low conduction losses
Ultra reliable LFPAK33 package – no glue, no wires, 175°C
Very low IDSS
1+:¥1.9674
500+:¥1.7885
1000+:¥1.7033
3000+:¥1.6222
限量供应

High efficiency due to low switching & conduction losses
Robust construction for demanding applications
Logic level gate
¥15.8821
限量供应

High efficiency due to low switching and conduction losses
Robust construction for demanding applications
Standard level gate
1+:¥11.7967
500+:¥10.7242
1000+:¥10.2136
3000+:¥9.7272
限量供应

Higher operating power due to low thermal resistance
Low conduction losses due to low on-state resistance
Simple gate drive required due to low gate charge
Suitable for high frequency applications due to fast switching characteristics
1+:¥6.8219
500+:¥6.2017
1000+:¥5.9064
3000+:¥5.6252
限量供应

Logic-level compatible
Trench MOSFET technology
MLPAK33 package (3.3 x 3.3 mm footprint)
1+:¥1.4500
500+:¥1.3182
1000+:¥1.2554
3000+:¥1.1957
限量供应

Logic-level compatible
Trench MOSFET technology
Ultra low QG and QGD for high system efficiency, especially at higher switching frequencies
Superfast switching with soft-recovery
Low spiking and ringing for low EMI designs
MLPAK33 package (3.3 x 3.3 mm footprint)
1+:¥1.2762
500+:¥1.1601
1000+:¥1.1049
3000+:¥1.0523
限量供应

Logic-level compatible
Trench MOSFET technology
Ultra low QG and QGD for high system efficiency, especially at higher switching frequencies
Superfast switching with soft-recovery
Low spiking and ringing for low EMI designs
MLPAK33 package (3.3 x 3.3 mm footprint)
1+:¥1.4844
500+:¥1.3494
1000+:¥1.2852
3000+:¥1.2240