限量供应
Logic-level compatible
Trench MOSFET technology
MLPAK33 package (3.3 x 3.3 mm footprint)
1+:¥1.7370
500+:¥1.5791
1000+:¥1.5039
3000+:¥1.4323
限量供应
100% avalanche tested at I(AS) = 190 A
Optimized for low RDSon
Low leakage < 1 μA at 25 °C
Low spiking and ringing for low EMI designs
Optimized for 4.5 V gate drive
Copper-clip for low parasitic inductance and resistance
High reliability LFPAK package, qualified to 175 °C
Wave solderable; exposed leads for optimal solder coverage and visual solder inspection
1+:¥6.0857
500+:¥5.5325
1000+:¥5.2690
3000+:¥5.0181
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥3.7938
500+:¥3.4490
1000+:¥3.2847
3000+:¥3.1283
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
Logic level gate operation
Avalanche rated, 100% tested
LFPAK provides maximum power density in a Power SO8 package
1+:¥3.8327
500+:¥3.4842
1000+:¥3.3183
3000+:¥3.1603
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥5.2980
500+:¥4.8164
1000+:¥4.5870
3000+:¥4.3686
限量供应
100% Avalanche tested at I(AS) = 169 A
Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
Superfast switching with soft-recovery
Low spiking and ringing for low EMI designs
Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at 25 °C
Optimised for 4.5 V gate drive
Low parasitic inductance and resistance
High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 175 °C
Wave solderable; exposed leads for optimal visual solder inspection
1+:¥3.5540
500+:¥3.2309
1000+:¥3.0770
3000+:¥2.9305
限量供应
High reliability Power SO8 package, qualified to 175°C
Optimised for 4.5V Gate drive utilising NextPower Superjunction technology
Ultra low QG, QGD & QOSS for high system efficiencies at low and high loads
Ultra low Rdson and low parasitic inductance
1+:¥3.0000
500+:¥2.7273
1000+:¥2.5974
3000+:¥2.4737
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥6.3591
500+:¥5.7810
1000+:¥5.5057
3000+:¥5.2435
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥2.0633
500+:¥1.8757
1000+:¥1.7864
3000+:¥1.7013
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥3.0449
500+:¥2.7680
1000+:¥2.6362
3000+:¥2.5107
限量供应
High efficiency due to low switching and conduction losses
Suitable for logic level gate drive sources
1+:¥1.6419
500+:¥1.4927
1000+:¥1.4216
3000+:¥1.3539
限量供应
High reliability Power SO8 package, qualified to 175°C
Optimised for 4.5V Gate drive utilising NextPower Superjunction technology
Ultra low QG, QGD, & QOSS for high system efficiencies at low and high loads
Ultra low Rdson and low parasitic inductance
1+:¥5.0653
500+:¥4.6048
1000+:¥4.3855
3000+:¥4.1767
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥1.6571
500+:¥1.5065
1000+:¥1.4347
3000+:¥1.3664
限量供应
High efficiency due to low switching and conduction losses
Robust construction for demanding applications
Standard level gate
1+:¥6.9397
500+:¥6.3088
1000+:¥6.0084
3000+:¥5.7223
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥1.6571
500+:¥1.5065
1000+:¥1.4347
3000+:¥1.3664
限量供应
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power converters
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
1+:¥1.6347
500+:¥1.4861
1000+:¥1.4153
3000+:¥1.3479
限量供应
Higher operating power due to low thermal resistance
Suitable for high frequency applications due to fast switching characteristics
1+:¥3.7316
500+:¥3.3924
1000+:¥3.2309
3000+:¥3.0770
限量供应
High efficiency due to low switching & conduction losses
Robust construction for demanding applications
Logic level gate
¥15.8821
限量供应
High efficiency due to low switching and conduction losses
Suitable for logic level gate drive sources
¥8.6428
限量供应
High efficiency due to low switching and conduction losses
Suitable for logic level gate drive sources
1+:¥11.4102
500+:¥10.3729
800+:¥9.6631
1000+:¥9.8789
3000+:¥9.4085