Low current (max. 100 mA)
Low voltage (max. 65 V)
1+:¥0.0654
500+:¥0.0594
1000+:¥0.0566
3000+:¥0.0539
Collector current capability IC = 200 mA
Collector-emitter voltage VCEO = 40 V
1+:¥0.0654
500+:¥0.0594
1000+:¥0.0566
3000+:¥0.0539
High current
Three current gain selections
1+:¥0.0856
500+:¥0.0778
1000+:¥0.0741
3000+:¥0.0706
1+:¥0.0735
500+:¥0.0668
1000+:¥0.0636
3000+:¥0.0606
High current
Three current gain selections
1+:¥0.0776
500+:¥0.0706
1000+:¥0.0672
3000+:¥0.0640
Low current (max. 100 mA)
Low voltage (max. 65 V)
1+:¥0.0633
500+:¥0.0576
1000+:¥0.0548
3000+:¥0.0522
Low current (max. 100 mA)
Low voltage (max. 30 V)
AEC-Q101 qualified
1+:¥0.0633
500+:¥0.0576
1000+:¥0.0548
3000+:¥0.0522
High current (max. 600 mA)
Low voltage (max. 40 V)
AEC-Q101 qualified
1+:¥0.0846
500+:¥0.0770
1000+:¥0.0733
3000+:¥0.0698
High current (max. 600 mA)
Low voltage (max. 40V)
Leadless ultra small SMD plastic package
Low package height of 0.50 mm
Power dissipation comparable to SOT23
1+:¥0.2020
500+:¥0.1837
1000+:¥0.1749
3000+:¥0.1666
High current
Three current gain selections
1+:¥0.0776
500+:¥0.0706
1000+:¥0.0672
3000+:¥0.0640
High voltage
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
1+:¥0.7725
500+:¥0.7023
1000+:¥0.6689
3000+:¥0.6370
General-purpose transistors
SMD plastic packages
Three different gain selections
1+:¥0.0654
500+:¥0.0594
1000+:¥0.0566
3000+:¥0.0539
300 mW total power dissipation
Very small 1.6 mm x 1.2 mm ultra thin package
Replaces two SC-75/SC-89 packaged transistors on same PCB area
Reduced required PCB area
Reduced pick and place costs
1+:¥0.4490
500+:¥0.4081
1000+:¥0.3887
3000+:¥0.3702
High current (max. 600 mA)
Low voltage (max. 40 V)
AEC-Q101 qualified
1+:¥0.0735
500+:¥0.0668
1000+:¥0.0636
3000+:¥0.0606
Low current (max. 100 mA)
Low voltage (max. 65 V)
1+:¥0.0654
500+:¥0.0594
1000+:¥0.0566
3000+:¥0.0539
Low current (max. 100 mA)
Low voltage (max. 65 V)
1+:¥0.0633
500+:¥0.0576
1000+:¥0.0548
3000+:¥0.0522
300 mW total power dissipation
Very small 1.6 mm x 1.2 mm x 0.55 mm ultra thin package
Excellent coplanarity due to straight leads
Low collector capacitance
Improved thermal behaviour due to flat leads
Reduces number of components as replacement of two SC-75/SC-89 packaged BISS transistors
Reduces required board space
Reduces pick and place costs
1+:¥0.4490
500+:¥0.4081
1000+:¥0.3887
3000+:¥0.3702
High current
Three current gain selections
1+:¥0.0856
500+:¥0.0778
1000+:¥0.0741
3000+:¥0.0706
High current (max. 600 mA)
Low voltage (max. 40V)
Leadless ultra small SMD plastic package
Low package height of 0.37 mm
Power dissipation comparable to SOT23
1+:¥0.2367
500+:¥0.2152
1000+:¥0.2050
3000+:¥0.1952
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High efficiency leading to reduced heat generation
Reduced printed-circuit board requirements.
AEC-Q101 qualified
1+:¥0.3276
500+:¥0.2978
1000+:¥0.2836
3000+:¥0.2701