High switching speed: trr ≤ 50 ns
Low capacitance: Cd ≤2 pF
Low leakage current
Reverse voltage: VR ≤ 300 V
Repetitive peak reverse voltage: VRRM ≤ 300 V
Very small and flat lead SMD plastic package
Excellent coplanarity and improved thermal behavior
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.1980
500+:¥0.1800
1000+:¥0.1715
3000+:¥0.1633
High switching speed: trr ≤ 50 ns
High reverse voltage: VR ≤ 300 V
Repetitive peak forward current: IFRM ≤ 1 A
Ultra small SMD plastic package
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.1908
500+:¥0.1734
1000+:¥0.1652
3000+:¥0.1573
High switching speed: trr ≤ 50 ns
Reverse voltage: VR ≤ 200 V
Repetitive peak reverse voltage: VRRM ≤ 250 V
Small SMD plastic package
Low capacitance: Cd ≤ 5 pF
Repetitive peak forward current: IFRM ≤ 1 A
AEC-Q101 qualified
1+:¥0.5174
500+:¥0.4703
1000+:¥0.4479
3000+:¥0.4266
Non-repetitive peak reverse power dissipation: ≤ 40 W
Total power dissipation: ≤ 300 mW
Wide working voltage range: nominal 2.4 V to 75 V (E24 range)
Two tolerance series: ± 2 % and ± 5 %
Low differential resistance
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.2081
500+:¥0.1892
1000+:¥0.1802
3000+:¥0.1716
Small plastic SMD package
Switching speed: max. 50 ns
General application
Continuous reverse voltage: max. 200 V
Repetitive peak reverse voltage: max. 250 V
Repetitive peak forward current: max. 625 mA
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.1235
500+:¥0.1122
1000+:¥0.1069
3000+:¥0.1018
Average forward current: IF(AV) ≤ 0.2 A
Reverse voltage: VR ≤ 60 V
Low forward voltage VF ≤ 600 mV
AEC-Q101 qualified
Solderable side pads
Package height typ. 0.37 mm
1+:¥0.3479
500+:¥0.3163
1000+:¥0.3012
3000+:¥0.2869
Non-repetitive peak reverse power dissipation: ≤ 180 W
Low differential resistance
Total power dissipation: ≤ 500 mW
AEC-Q101 qualified
Very small plastic package suitable for surface-mounted design
1+:¥0.2173
500+:¥0.1976
1000+:¥0.1882
3000+:¥0.1792
新品
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.4061
500+:¥0.3692
1000+:¥0.3516
3000+:¥0.3349
Average forward current: IF(AV) ≤ 2 A
Reverse voltage: VR ≤ 100 V
Low forward voltage: VF = 770 mV
High power capability due to clip-bonding technology
Extremely low leakage current IR = 40 nA
High temperature Tj ≤ 175 °C
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.5419
500+:¥0.4926
1000+:¥0.4691
3000+:¥0.4468
Non-repetitive peak reverse power dissipation: ≤ 40 W
Wide working voltage range: nominal 2.4 V to 75 V (E24 range)
Total power dissipation: ≤ 550 mW
Two tolerance series: ±2 % and ±5 %
AEC-Q101 qualified
Low differential resistance
Small plastic package suitable for surface-mounted design
1+:¥0.2132
500+:¥0.1938
1000+:¥0.1846
3000+:¥0.1758
Total power dissipation: Ptot ≤ 250 mW
Wide working voltage range: nominal 2.4 V to 75 V (E24 range)
Two tolerance series: ± 2 % and ± 5 %
Leadless ultra small plastic package suitable for surface-mounted design
AEC-Q101 qualified
1+:¥0.2011
500+:¥0.1828
1000+:¥0.1741
3000+:¥0.1658
Low forward voltage
Low capacitance
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.1184
500+:¥0.1076
1000+:¥0.1025
3000+:¥0.0976
High switching speed: trr ≤ 50 ns
Low leakage current: IR ≤ 100 nA
High reverse voltage VR ≤ 200 V
Low capacitance: Cd ≤ 2 pF
Ultra small and leadless SMD plastic package
Soldarable side pads
Package height typ. 0.37 mm
AEC-Q101 qualified
1+:¥0.2143
500+:¥0.1948
1000+:¥0.1855
3000+:¥0.1767
Forward current: IF ≤ 0.5 A
AEC-Q101 qualified
Reverse voltage: VR ≤ 20 V
Solderable side pads
Low forward voltage: VF ≤ 500 mV
Package height typ. 0.37 mm
Low reverse current
Ultra small and leadless SMD plastic package
1+:¥0.3950
500+:¥0.3591
1000+:¥0.3420
3000+:¥0.3257
Average forward current: IF(AV) ≤ 4.5 A
Reverse voltage: VR ≤ 60 V
Low forward voltage
High power capability due to clip-bonding technology
Small and flat lead SMD plastic package
High temperature Tj ≤ 175 °C
Suitable for both reflow and wave soldering
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥1.2072
500+:¥1.0974
1000+:¥1.0452
3000+:¥0.9954
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 60 V
Low forward voltage
Low leakage current due to Trench MEGA Schottky technology
High power capability due to clip-bonding technology
Small and flat lead SMD power plastic package
Suitable for both reflow and wave soldering
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥1.1521
500+:¥1.0474
1000+:¥0.9975
3000+:¥0.9500
Non-repetitive peak reverse power dissipation: ≤ 40 W
Wide working voltage range: nominal 2.4 V to 75 V (E24 range)
Total power dissipation: ≤ 550 mW
Two tolerance series: ±2 % and ±5 %
AEC-Q101 qualified
Low differential resistance
Small plastic package suitable for surface-mounted design
1+:¥0.2132
500+:¥0.1938
1000+:¥0.1846
3000+:¥0.1758
Non-repetitive peak reverse power disspation: ≤ 40 W
Total power dissipation: ≤ 300 mW
Tolerance series: ± 2 %
Wide working voltage range: nominal 2.4 V to 36 V
Low differential resistance
AEC-Q101 qualified
1+:¥0.1908
500+:¥0.1734
1000+:¥0.1652
3000+:¥0.1573