Forward current: IF ≤ 0.5 A
Reverse voltage: VR ≤ 30 V
Very low forward voltage
Ultra small SMD plastic package
1+:¥0.4980
500+:¥0.4527
1000+:¥0.4311
3000+:¥0.4106
Extremely low leakage current IR = 340 nA
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 60 V
Low forward voltage VF = 600 mV
High power capability due to clip-bonding technology
High temperature Tj ≤ 175 °C
Small and flat lead SMD plastic package
Suitable for both reflow and wave soldering
1+:¥1.0245
500+:¥0.9314
1000+:¥0.8870
3000+:¥0.8448
Forward current: IF ≤ 1 A
Reverse voltage: VR ≤ 30 V
Low forward voltage typ. VF = 450 mV
Low reverse current typ. IR = 40 µA
Small SMD plastic package
1+:¥0.2316
500+:¥0.2106
1000+:¥0.2006
3000+:¥0.1910
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage, typical: VF = 435 mV
Low reverse current, typical: IR = 325 µA
Package height typ. 270 µm
1+:¥0.3470
500+:¥0.3154
1000+:¥0.3004
3000+:¥0.2861
Forward current: IF ≤ 0.5 A
Reverse voltage: VR ≤ 30 V
Low forward voltage typ. VF = 380 mV
Low reverse current typ. IR = 40 µA
Small SMD plastic package
1+:¥0.2265
500+:¥0.2059
1000+:¥0.1961
3000+:¥0.1868
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
High power capability due to clip-bond technology
Small and flat lead SMD plastic package
1+:¥0.4102
500+:¥0.3729
1000+:¥0.3551
3000+:¥0.3382
High switching speed
Low leakage current
High breakdown voltage
Low capacitance
1+:¥0.6714
500+:¥0.6103
1000+:¥0.5813
3000+:¥0.5536
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
Low leakage current due to Trench MEGA Schottky technology
High power capability due to clip-bonding technology
Small and flat lead SMD plastic package
Suitable for both reflow and wave soldering
1+:¥0.6388
500+:¥0.5807
1000+:¥0.5530
3000+:¥0.5267
Forward current: IF ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage typ. VF = 540 mV
Low reverse current typ. IR = 30 µA
Small SMD plastic package
1+:¥0.2316
500+:¥0.2106
1000+:¥0.2006
3000+:¥0.1910
Forward current: IF ≤ 0.2 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
Leadless ultra small SMD plastic package
Power dissipation comparable to SOT23
1+:¥0.1459
500+:¥0.1326
1000+:¥0.1263
3000+:¥0.1203
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 30 V
Low forward voltage, typical: VF = 415 mV
Low reverse current, typical: IR = 300 µA
Package height typ. 270 µm
1+:¥0.3470
500+:¥0.3154
1000+:¥0.3004
3000+:¥0.2861
Average forward current: IF(AV) ≤ 0.5 A
Reverse voltage: VR ≤ 20 V
Low forward voltage VF ≤ 390 mV
Ultra small and leadless SMD plastic package
Solderable side pads
Package height typ. 0.37 mm
1+:¥0.3950
500+:¥0.3591
1000+:¥0.3420
3000+:¥0.3257
Forward current: IF ≤ 0.2 A
Reverse voltage: VR ≤ 30 V
Ultra small SMD plastic package
Low forward voltage
Suitable for Automatic Optical Inspection (AOI) of solder joint
1+:¥0.1970
500+:¥0.1790
1000+:¥0.1705
3000+:¥0.1624
Forward current: 2 A
Reverse voltage: 30 V
Ultra low forward voltage
Small and flat lead SMD plastic package
1+:¥0.5714
500+:¥0.5195
1000+:¥0.4948
3000+:¥0.4712
Forward current: : IF ≤ 1 A
Reverse voltage: VR ≤ 30 V
Very low forward voltage
Small and flat lead SMD plastic package
1+:¥0.3693
500+:¥0.3357
1000+:¥0.3197
3000+:¥0.3045
Average forward current IF(AV) ≤ 0.5 A
Reverse voltage VR ≤ 30 V
Low forward voltage typ. VF = 310 mV
Low reverse current typ. IR = 0.33 µA
Package height typ. 0.3 mm
1+:¥0.2959
500+:¥0.2690
1000+:¥0.2562
3000+:¥0.2440
1+:¥0.2959
500+:¥0.2690
1000+:¥0.2562
3000+:¥0.2440
Forward current: ≤ 1 A
Reverse voltage: ≤ 20 V
Very low forward voltage
Very small and flat lead SMD plastic package
AEC-Q101 qualified
1+:¥0.4755
500+:¥0.4323
1000+:¥0.4117
3000+:¥0.3921