High switching speed
Low leakage current
High breakdown voltage
Low capacitance
1+:¥0.1480
500+:¥0.1345
1000+:¥0.1281
3000+:¥0.1220
Very low forward voltage
Guard ring protected
Ultra small SMD package
1+:¥0.2153
500+:¥0.1957
1000+:¥0.1864
3000+:¥0.1775
Low forward voltage
Low capacitance
1+:¥0.0797
500+:¥0.0724
1000+:¥0.0690
3000+:¥0.0657
Forward current: IF ≤ 1 A
Reverse voltage: VR ≤ 30 V
Low forward voltage typ. VF = 450 mV
Low reverse current typ. IR = 40 µA
Small SMD plastic package
1+:¥0.2316
500+:¥0.2106
1000+:¥0.2006
3000+:¥0.1910
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage, typical: VF = 435 mV
Low reverse current, typical: IR = 325 µA
Package height typ. 270 µm
1+:¥0.3470
500+:¥0.3154
1000+:¥0.3004
3000+:¥0.2861
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
High power capability due to clip-bond technology
Small and flat lead SMD plastic package
1+:¥0.4102
500+:¥0.3729
1000+:¥0.3551
3000+:¥0.3382
Forward current: IF ≤ 1 A
Reverse voltage: VR ≤ 60 V
Very low forward voltage
Small and flat lead SMD plastic package
1+:¥0.3693
500+:¥0.3357
1000+:¥0.3197
3000+:¥0.3045
Forward current: IF ≤ 0.5 A
Reverse voltage: VR ≤ 30 V
Low forward voltage typ. VF = 380 mV
Low reverse current typ. IR = 40 µA
Small SMD plastic package
1+:¥0.2265
500+:¥0.2059
1000+:¥0.1961
3000+:¥0.1868
High switching speed
Low leakage current
High breakdown voltage
Low capacitance
1+:¥0.6714
500+:¥0.6103
1000+:¥0.5813
3000+:¥0.5536
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Small and flat lead SMD power plastic package
1+:¥2.6562
500+:¥2.4147
1000+:¥2.2997
3000+:¥2.1902
Low forward voltage
Low capacitance
1+:¥0.1072
500+:¥0.0975
1000+:¥0.0928
3000+:¥0.0884
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
Low leakage current due to Trench MEGA Schottky technology
High power capability due to clip-bonding technology
Small and flat lead SMD plastic package
Suitable for both reflow and wave soldering
1+:¥0.6388
500+:¥0.5807
1000+:¥0.5530
3000+:¥0.5267
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
High power capability due to clip-bond technology
Small and flat lead SMD plastic package
1+:¥0.6092
500+:¥0.5538
1000+:¥0.5274
3000+:¥0.5023
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 60 V
Low forward voltage, typical: VF = 525 mV
Low reverse current, typical: IR = 185 µA
Package height typ. 270 µm
1+:¥0.3847
500+:¥0.3497
1000+:¥0.3331
3000+:¥0.3172
Forward current: IF ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage typ. VF = 540 mV
Low reverse current typ. IR = 30 µA
Small SMD plastic package
1+:¥0.2316
500+:¥0.2106
1000+:¥0.2006
3000+:¥0.1910
Forward current: IF ≤ 0.5 A
Reverse voltage: VR ≤ 40 V
Low forward voltage typ. VF = 420 mV
Low reverse current typ. IR = 30 µA
Small SMD plastic package
1+:¥0.2265
500+:¥0.2059
1000+:¥0.1961
3000+:¥0.1868
Forward current: IF ≤ 0.2 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
Leadless ultra small SMD plastic package
Power dissipation comparable to SOT23
1+:¥0.1459
500+:¥0.1326
1000+:¥0.1263
3000+:¥0.1203
Forward current: IF ≤ 2 A
Reverse voltage: VR ≤ 30 V
Low forward voltage typ. VF = 510 mV
Low reverse current typ. IR = 400 µA
Small SMD plastic package
1+:¥0.3633
500+:¥0.3303
1000+:¥0.3146
3000+:¥0.2996
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 30 V
Low forward voltage, typical: VF = 415 mV
Low reverse current, typical: IR = 300 µA
Package height typ. 270 µm
1+:¥0.3470
500+:¥0.3154
1000+:¥0.3004
3000+:¥0.2861