
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 8 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.7334
500+:¥1.5758
1000+:¥1.5008
3000+:¥1.4293

Reverse voltage VR ≤ 200 V
Forward current IF ≤ 1 A
Hyperfast recovery time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥0.4787
500+:¥0.4352
1000+:¥0.4145
3000+:¥0.3947

Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥0.4948
500+:¥0.4498
1000+:¥0.4284
3000+:¥0.4080

Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q qualified
1+:¥0.5957
500+:¥0.5415
1000+:¥0.5157
3000+:¥0.4912
新品

Reverse voltage VR ≤ 650 V
Forward current IF ≤ 3 A
Typical switching time trr of 41 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥1.2225
500+:¥1.1114
1000+:¥1.0584
3000+:¥1.0080
新品

Reverse voltage VR ≤ 650 V
Forward current IF ≤ 2 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥1.0186
500+:¥0.9260
1000+:¥0.8819
3000+:¥0.8399
新品

Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥0.7663
500+:¥0.6967
1000+:¥0.6635
3000+:¥0.6319
新品

Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥0.8211
500+:¥0.7464
1000+:¥0.7109
3000+:¥0.6770

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥2.1756
500+:¥1.9778
1000+:¥1.8836
3000+:¥1.7939

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 6 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.5016
500+:¥1.3650
1000+:¥1.3000
3000+:¥1.2381

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 3 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.7398
500+:¥1.5817
1000+:¥1.5063
3000+:¥1.4346

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥0.9552
500+:¥0.8684
1000+:¥0.8270
3000+:¥0.7877

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥0.8951
500+:¥0.8138
1000+:¥0.7750
3000+:¥0.7381

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.3770
500+:¥1.2519
1000+:¥1.1922
3000+:¥1.1355

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 2 A (per diode)
Switching time: trr ≤ 25 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.1420
500+:¥1.0382
1000+:¥0.9887
3000+:¥0.9417

Reverse voltage VR ≤ 200 V
Forward current IF ≤ 3 A
Switching time trr ≤ 30 ns
Pt doped life time control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥0.7535
500+:¥0.6850
1000+:¥0.6523
3000+:¥0.6213

Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Low forward voltage
Pt doped lifetime control
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
1+:¥0.6032
500+:¥0.5484
1000+:¥0.5222
3000+:¥0.4974
新品

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 1 A
Hyperfast recovery time: trr ≤ 25 ns
Planar die design with Pt doped life time control
Low inductance
Small and flat lead SMD plastic package, typical height 0.68 mm
High power capability due to clip-bond technology
1+:¥0.3520
500+:¥0.3200
1000+:¥0.3048
3000+:¥0.2903

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 10 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.9931
500+:¥1.8119
1000+:¥1.7256
3000+:¥1.6435

Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥2.3924
500+:¥2.1749
1000+:¥2.0713
3000+:¥1.9727