Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 8 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.6479
500+:¥1.4981
1000+:¥1.4267
3000+:¥1.3588
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 6 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.4275
500+:¥1.2978
1000+:¥1.2360
3000+:¥1.1771
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 2 A (per diode)
Switching time: trr ≤ 25 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.0858
500+:¥0.9871
1000+:¥0.9401
3000+:¥0.8953
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 10 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.8949
500+:¥1.7227
1000+:¥1.6406
3000+:¥1.5625
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥0.7805
500+:¥0.7096
1000+:¥0.6758
3000+:¥0.6436
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 3 A
Switching time trr ≤ 30 ns
Pt doped life time control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥0.7877
500+:¥0.7161
1000+:¥0.6820
3000+:¥0.6495
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥0.5285
500+:¥0.4805
1000+:¥0.4576
3000+:¥0.4358
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Low forward voltage
Pt doped lifetime control
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
1+:¥0.6306
500+:¥0.5733
1000+:¥0.5460
3000+:¥0.5200
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 1 A
Hyperfast recovery time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥0.5256
500+:¥0.4778
1000+:¥0.4551
3000+:¥0.4334
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 3 A
Typical switching time trr of 41 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥1.1623
500+:¥1.0566
1000+:¥1.0063
3000+:¥0.9584
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q qualified
1+:¥0.6236
500+:¥0.5669
1000+:¥0.5399
3000+:¥0.5142
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 2 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥0.9684
500+:¥0.8803
1000+:¥0.8384
3000+:¥0.7985
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥0.7285
500+:¥0.6623
1000+:¥0.6307
3000+:¥0.6007
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥2.0683
500+:¥1.8803
1000+:¥1.7908
3000+:¥1.7055
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 3 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.6541
500+:¥1.5037
1000+:¥1.4321
3000+:¥1.3639
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥0.9991
500+:¥0.9082
1000+:¥0.8650
3000+:¥0.8238
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥0.9358
500+:¥0.8507
1000+:¥0.8102
3000+:¥0.7716
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥1.3092
500+:¥1.1901
1000+:¥1.1335
3000+:¥1.0795
新品
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 1 A
Hyperfast recovery time: trr ≤ 25 ns
Planar die design with Pt doped life time control
Low inductance
Small and flat lead SMD plastic package, typical height 0.68 mm
High power capability due to clip-bond technology
1+:¥0.3683
500+:¥0.3348
1000+:¥0.3189
3000+:¥0.3037
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥2.2745
500+:¥2.0677
1000+:¥1.9693
3000+:¥1.8755