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特性

  • Fully automotive qualified to AEC-Q101:
    • 175 °C rating suitable for thermally demanding environments

  • Trench 9 Superjunction technology:
    • Reduced cell pitch enables enhanced power density and efficiency with lower RDSon in same footprint

    • Improved SOA and avalanche capability compared to standard TrenchMOS

    • Tight VGS(th) limits enable easy paralleling of MOSFETs

  • LFPAK Gull Wing leads:
    • High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages

    • Visual (AOI) soldering inspection, no need for expensive x-ray equipment

    • Easy solder wetting for good mechanical solder joint

  • LFPAK copper clip technology:
    • Improved reliability, with reduced Rth and RDSon

    • Increases maximum current capability and improved current spreading

目标应用

  • 12 V automotive systems

  • Motors, lamps and solenoid control

  • Start-Stop micro-hybrid applications

  • Transmission control

  • Ultra high performance power switching