库存: 99999999
数量:
单价: ¥3
总价: ¥3

特性

  • Fully automotive qualified to beyond AEC-Q101:

    • -55 °C to +175 °C rating suitable for thermally demanding environments

  • LFPAK88 package:

    • Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications

    • Thin package and copper clip enables LFPAK88 to be highly efficient thermally

  • LFPAK copper clip technology enabling improvements over wire bond packages by:

    • Increased maximum current capability and excellent current spreading

    • Improved RDSon

    • Low source inductance

    • Low thermal resistance Rth

  • LFPAK Gull Wing leads:

    • Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages

    • Visual (AOI) soldering inspection, no need for expensive x-ray equipment

    • Easy solder wetting for good mechanical solder joint

  • Unique 40 V Trench 9 superjunction technology:

    • Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint

    • Improved SOA and avalanche capability compared to standard TrenchMOS

    • Tight VGS(th) limits enable easy paralleling of MOSFETs

目标应用

  • 12 V automotive systems

  • 48 V DC/DC systems (on 12 V secondary side)

  • Higher power motors, lamps and solenoid control

  • Reverse polarity protection

  • Ultra high performance power switching