Average forward current I_F(AV) ≤ 1 A

Reverse voltage V_R ≤ 40 V

Low forward voltage V_F ≤ 500 mV

Low reverse current

Reduced Printed-Circuit-Board (PCB) area requirements

Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity

Leadless small SMD plastic package with visible and solderable side pads

Suitable for Automatic Optical Inspection (AOI) of solder joints

AEC-Q101 qualified